@InProceedings{Supelec610,
author = {Germain Sabot and Julien Chaudenson and Franck Raulin and Joel Jacquet},
title = {{Thermal dissipation modeling in optical components modules for electrical power consumption optimization}},
year = {2010},
booktitle = {{Proceedings of SPIE (Optical Components and Materials VII)}},
volume = {7585},
number = {0V},
month = {jan},
address = {San Francisco (USA)},
url = {http://dx.doi.org/10.1117/12.842657},
doi = {10.1117/12.842657},
abstract = {In a semi-conductor optical amplifier (SOA) as in any other
optical devices, the performances that can be reached is strongly
dependent on the chip temperature. For example, the optical
output power of a laser or the optical gain in a SOA is reduced
when the temperature of the junction increases. This latter can
be controlled or monitored thanks to a thermo-electronic cooler
(or a Peltier element) and a thermistor. In this paper, we first
have calculated the thermal resistance of various semiconductor
structures such as buried or ridge waveguides lasers. We then
calculate the Peltier consumption necessary to maintain a given
temperature. The influence of the thermistor position as well as
the module conception have been investigated in these
calculation. The size of the different mechanical elements, the
nature and thermal properties of the material use for the module
fabrication have been found to play an important role in the
thermal performance of the optical modules. The Peltier size is
defined by maximizing its efficiency. It depends on the power to
be dissipated as well as the temperature operation of the device.
The latter depends on the performance expected by the optical
devices. We discussed the optimization of the device structure
associated to its packaging to find the best compromise between
performance and electrical consumption. The trade-off found
depends on the temperature at which the device operates as well
as on the thermal power to be dissipated.}
}